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Thin Film Attenuator Pads
2013-02-06 15:18:29 嘉兆科技（深圳）有限公司 发布
详细信息
The Aeroflex / Metelics fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology.
All devices are available in chip form with a metallized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground bonding ribbon is not required.
The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable.
Custom values and configuration available on request.
- Medium Power Handling 2W CW
- Flat Response From DC to 40 GHz
- Return Loss > 18 dB, DC to 12 GHz
- Return Loss > 16 dB, 13 to 40 GHz
- Space Saving Footprint .030” X .030” (.762 X .762mm)
- Very Good Stability Over Temperature (TCR < 100 PPM)
- Ground Wrap to Top (No ground bonding required)
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